Scihuhuan平台已收录预计检索 <10 秒
Vacuum-assisted void-free copper filling of high-aspect-ratio through-glass vias for advanced interposers
查看已审核书目、规范引用与获取指引。下载与积分规则登录后查看。
文献信息
- 题目
- Vacuum-assisted void-free copper filling of high-aspect-ratio through-glass vias for advanced interposers
- 作者
- Hyemin An, Sangyeun Park, Yonghyun Kim, Hoyoon Lee, Gayoung Kim, Kyunam Lee, Seakjoon Lee, Hongyun So
- 发表年份
- 2026
- 期刊 / 来源
- Journal of Materials Research and Technology
- 出版社
- Elsevier
- 文献类型
- 学术文献
- 平台记录更新
- 2026-09-03 21:57:26
本页由 Scihuhuan.com 学术互换提供文献检索、引用与获取指引；论文版权和出版身份归原出版方。
引用格式
同来源相关文献
Role of Ni content on microstructural and mechanical responses of Nb-stabilized metastable austenitic stainless steel weld metals2023 · Journal of Materials Research and TechnologyProcess-parameter-dependent defects formation mechanisms in laser powder bed fusion of non-weldable nickel-based superalloy2026 · Journal of Materials Research and TechnologyProbing low-temperature hydrogen embrittlement behavior in pipeline steel weld metals: Comparative study of X52 and X80 grades2026 · Journal of Materials Research and TechnologyMicrostructure quantitative analysis of multi-scale pores in C/SiC composites via micro-CT for revealing correlations with interlaminar shear properties2025 · Journal of Materials Research and TechnologyInvestigation of microstructure and cryogenic impact toughness of laser-arc hybrid welded austenitic steels with temperature variation2026 · Journal of Materials Research and TechnologyFast heating annealing of V-microalloyed TWIP steel: Pathway to ultrafine grains and enhanced mechanical performance2025 · Journal of Materials Research and Technology