Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging

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题目: Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging
作者: Junjie Cheng, Wenpeng Duan, Qiguang Liu, Chang Jing, Zhenfeng Zhu, Jue Cheng, Jiahao Ma, Junying Zhang
发表年份: 2026
期刊 / 来源: Chemical Engineering Journal
出版社: Elsevier
DOI: 10.1016/j.cej.2026.174268
文献类型: 学术文献
平台记录更新: 2026-09-12 00:31:13

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